PCB Pad锡量印刷不足造成无法与Solder Ball相接合,导致焊接OPEN. 四、BGA Pad与Ni/Sn IMC间裂缝 BGA Pad表面污染与Ball未形成良好IMC alloy,造成焊接后锡球脱落于PCB PAD上。故﹐切片可见BGA Pad与Ni/Sn IMC裂缝(open). 五、PCB Pad与Cu/Sn IMC间裂缝 如图: 1.BGA Ball锡量充足﹑Solder ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

当看到PQFP封装的种种不足之后，工程师们开始着手对PQFP封装进行改进，将长长的针状引脚改为触点，并且将触点排放在了芯片的底部，通过球型焊锡与PCB连接，这就是我们常见的BGA球状矩阵排列封装。 采用BGA封装的Riva 128图形芯片 早期采用BGA封装的IntelI740图形 ...

FC-BGA（Flip Chip Ball Grid Array）这种被称为倒装芯片球栅格阵列的封装格式，也是目前图形加速芯片最主要的封装格式。这种封装技术始于1960年代，当时IBM为了大型计算机的组装，而开发出了所谓的C4(Controlled Collapse Chip Connection)技术，随后进一步发展成可以利用 ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

A trio of high-speed SigmaRAM SRAMs are being made using a 0.13-µm CMOS process that have a capacity of 18 Mb and low power consumption. The three SRAMs are known as: Double Late Write and Pipelined ...