化学机械平面化 (CMP) 工艺是用于晶圆和磁盘驱动器行业的抛光工艺。上节已经讲述了cmp工序的基本知识，但没有强调在CMP 后清洁工艺的作用。为了获得更好的表面外观，CMP 工程师应同时考虑cmp工艺和CMP 后清洗工艺的稳定性。 化学机械平坦化 (CMP) 工艺的表面 ...

At the semicon west semiconductor equipment and materials trade show in San Francisco last month, competing announcements spelled potential trouble for companies in the fast-growing business of ...