Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Researchers from Northwestern University, University of Virginia, Carnegie Mellon University, and Argonne National Laboratory have made a significant advancement in defect detection and process ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Discover how Lean Six Sigma enhances performance by combining Six Sigma and Lean methods to reduce waste and defects, ...

Understanding your company’s manufacturing process and how to minimize defects has always been important. Today, its importance is increasing with the complexity of products and the customers' demand ...

With every process node advance, new types of manufacturing defects manifest. These defects are especially prevalent during the early phase. For early adopters, silicon manufacturing tests must evolve ...