HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Chemical mechanical polishing (CMP) of silicon carbide (SiC) is an essential process in the fabrication of high-performance semiconductor devices. SiC is prized for its exceptional hardness, thermal ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...

PHOENIX, Ariz. and HSINCHU, Taiwan — September 12, 2007— Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization technology for the global ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...