Electrical capacitance techniques offer a non‐invasive means to probe the hidden dynamics of plant root systems. Recent advances have demonstrated that carefully measured electrical properties can ...

Depending upon the distance between the surface of a capacitance probe and a target source, the electrical capacitance that is formed between these two objects will vary. In an effort to improve ...

Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for ...