System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

In the on-going commitment to reduce weight even further in automotive structures, many OEMs and suppliers are focusing on implementing the best and most cost-effective processing techniques to ...

AZoM talks to DeWayne Howell and Jason Gabriel (Technical Engineering TenCate/CCS Composites), about the process of compression molding for composites and what the benefits and applications of this ...

Here, Klaus Ritter, Head of the Centre of Excellence for Composites at Huntsman Advanced Materials, looks at how the company is helping to optimise the latest out-of-autoclave manufacturing techniques ...