Indium Corporation has released its SACM technology platform, a high-reliability solder alloy that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal ...
- High-reliability alloys, which perform better than SAC for automotive applications, enable reliable solder interconnect when thermal cycling up to 150 degree C. Indium Corporation's Indalloy 276 and ...
Engineered to withstand 3,000+ thermal cycles at -40 °C/125 °C across different PCB finishes and component types, Durafuse ® HR is ideal for applications requiring an extended mission profile beyond ...
“Engineers often limit their choices to established reliability devices that are outlined in active military performance specifications or customer drawings. KEMET's tin/lead terminated products ...
AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ — PulseForge, Inc. (PFI), the inventors of Photonic Soldering technology, today announced a major ...
Indium Corporation will feature its new technology platform using the SACM Solder Alloy at Productronica November 12-15 in Munich, Germany. Indium Corporation will be exhibiting at stand A4-402. SACM ...
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