Ensuring the quality of silicon and organic interposers is becoming harder as the number of signals passing through them continues to grow, fueled by more chiplets, higher processing demands, and more ...

Teledyne Lecroy’s PCIe 5.0 Mini Cool Edge IO (MCIO) interposer works with its Summit family of protocol analyzers to capture and decode PCIe 5.0 traffic. The interposer enables engineers to test ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...