With the miniaturization of many products, manufacturers are streamlining devices to pack more features into smaller packages. For instance, the pitch (spacing) between contacts in electrical ...

The direct, or inline-compounding (ILC), process has been a major boon to thermoplastic composites during the past decade. Direct processing has driven significant growth in the use of such materials ...

A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

About Core Molding Technologies Inc. Core Molding Technologies, Inc. is an engineered materials company specializing in molded thermoplastic and thermoset structural products, principally in building ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...