Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...

The AI model rapidly maps boundary conditions to molecular alignment and defect locations, replacing hours of simulation and ...

Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

Quantum engineers have spent years trying to tame the fragility of qubits, only to be thwarted by the tiniest imperfections in the materials they use. Now a new line of research flips that problem on ...