The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...
It's easy to model symbolically complex systems and boundary conditions while transparently integrating into most popular graphical modelers such as MSC Patran/Nastran, UGS-Femap, 3G.Author, Ansys, ...
With its industry-standard tool for thermal and fluid analysis of space applications and satellites, C&R Technologies' thermal-centric modeling approach provides fast and effective system-level ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...
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