Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

Emil Otto is aiming at joining steel, stainless steel, brass and copper objects below 450°C with three tin-based soft-soldering pastes. “The soldering and tinning pastes do not require zinc chloride, ...

SHENMAO America, Inc. is proud to announce the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder ...

FCT assembly is offering a variety of anti-tombstoning option with each of its solder pastes. “The anti-tombstoning solder pastes present an excellent way to reduce the potential for tombstoning”, ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

If you’re struggling with oxidised pads and components, combat the challenge with Koki’s S3X58-M500C-7 powerful wetting, no-clean solder paste Most engineers and operators have experienced poor solder ...

One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...