LONDON — Alchimer SA (Massy, France), a provider of wet deposition processes for semiconductor interconnects and 3-D through-silicon vias (TSV), has said it has found a way to eliminate the seed-layer ...
PARIS — Alchimer SA, France-based provider of wet deposition processes for interconnections in 3D packaging applications, announced it has introduced a deposition process that is said to reduce cost ...
From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
Deep Reactive Ion Etch (DRIE) processes used to form through silicon vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must ...
AUSTIN, TX--(Marketwired - May 30, 2014) - SACHEM is announcing the release of Reveal Etch™, a wet chemistry designed to enable a single-step silicon etch / TSV reveal process. SACHEM and Solid State ...
Hsinchu, Taiwan, July 20, 2015 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered volume production for ...
FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX ® 320 TSV Metrology System to CEA-Leti, a leading research organization based in ...
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