Flexibility: Applied’s most significant new platform in more than a decade hosts an unprecedented wide variety of chamber types, sizes and configurations, from Applied and partners Intelligence: ...

Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...

Flexibility: Applied’s most significant new platform in more than a decade hosts an unprecedented wide variety of chamber types, sizes and configurations, from Applied and partners Intelligence: ...

Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...

NexWafe’s continuous, direct gas-to-wafer manufacturing process also minimizes waste, resulting in wafers that are less expensive than conventional wafers. NexWafe’s in-line, ultra-scalable process ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...