KALISPELL, Mont., June 27, 2024 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...

The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly hit a new record of 19.6% efficiency for cells using 1366's 'Direct wafer' process ...

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...

NOTTINGHAM, England--(BUSINESS WIRE)--A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by ...

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have ...

The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...

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In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...