全球IC载板市场正从2023年高达16%的跌幅中逐步复苏，预计到2031年，市场规模将突破250亿美元，并在此之前保持持续增长态势。IC载板市场增长主要集中在服务于人工智能（AI）加速器及超大规模数据中心的FC-BGA和2.5D/3D封装载板领域；相 ...
As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
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