AI toolkit turns microscopy images into multi-feature microstructure datasets

A research team from The Hong Kong University of Science and Technology (HKUST) has developed GrainBot, an AI-enabled toolkit that automatically extracts and quantifies multiple microstructural ...
Semiconductor Engineering

Tool And Methodology Changes Coming In Fab And Package Automation

How new equipment and methodologies are improving reliability, yield, and time-to-market for multi-die assemblies.