For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

How researchers are modifying basic materials to enhance and tailor transducer performance. Efforts and results achieved with piezoelectric materials. Efforts and results achieved with triboelectric ...