So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

Advanced Packaging (AP) has now become recognized even by the Fabless Chip Designers of the now Silicon LESS Silicon Valley ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, ...

This Bachelor's End Project (BEP) at TU/e focuses on developing and characterizing a simplified gold-bump flip-chip bonding process for RF integrated circuit applications. The project demonstrates a ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today the industry’s first Fan-Out Chip on Substrate Chip First ...

Other than how PCB prototypes are produced,designers also care about the PCB assembly process steps that lead to a completed product. In our last blog we discussed how PCBs are produced, and now we ...

Abstract: A new process utilizing room temperature liquid metals as interconnect material for flip chip assembly of active circuits has been demonstrated. These interconnects form flexible bonds ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Abstract: This paper describes the assembly of integrated circuits on flexible substrates in an industrial flip chip process allowing reel-to-reel production. Die bonding concepts to meet future ...

AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market. Enables a tailored coefficient of thermal expansion, ...