Applied Materials AMAT expects its leading-edge foundry, logic, DRAM and high-bandwidth memory (HBM) to be the fastest-growing wafer fabrication equipment businesses in 2026. In Logic, AMAT’s revenues ...

Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor assembly ...

The MarketWatch News Department was not involved in the creation of this content. FISHKILL, N.Y., Feb. 24, 2026 /PRNewswire/ -- Great Lakes Semiconductor (GLS) and Advanced Printed Electronic ...

Plisinski stated, "we estimate advanced packaging revenue to grow over 30% in 2026, resulting in a new revenue record for this market." He also projected revenue for the first quarter to be in the ...

CD BioSustainable launches a material system bridging 3D printing performance and sustainable packaging for advanced manufacturing. NEW YORK, NY, UNITED STATES ...

Regional Foundation Specialist Implements Enhanced Geotechnical Solutions to Mitigate Subsurface Void Formation and Structural Settlement in Unstable Soils MADISON ...

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance gains are increasingly driven by heterogeneous integration ...

Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Mon, February 16, 2026 at 8:20 PM UTC Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI investors will want to keep an eye on in 2026.