Abstract: This paper proposes a fixture-free 2D sewing system using a dual-arm manipulator, i.e., the seam lines of the top and bottom fabric parts are the same. The proposed 2D sewing system sews two ...

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...