Agreement Brings Together Technology Innovators to Support Next-Generation Satellite Communications, Defense, and Terrestrial Energy Transfer Applications Circuits Integrated Hellas and Reach Power ...
The Ministry of Science, Technology and Innovation (MOSTI) through MIMOS Bhd is focusing on integrated circuit (IC) design, advanced packaging ...
The 1st International Electronics, Packaging, Design & Manufacturing Conference EPDMC 2026 concluded today at Manav Rachna Intern ...
Enabling scalable power for AI computing and next-generation robotics Our new GaN integrated circuits enable more ...
KUALA LUMPUR, March 4 (Bernama) -- The Ministry of Science, Technology and Innovation (MOSTI) through MIMOS Bhd is focusing on integrated circuit (IC) design, advanced packaging and high-value ...
AI plays a huge role in the semiconductor industry, both by facilitating more efficient development processes and as a target application in development work. This is why the Fraunhofer Heilbronn ...
Uniquely configured PA + SPDT integration delivers ultra-fast switching, reduced footprint and lower total system cost for ...
A research team has successfully implemented a programmable spinor lattice on a photonic integrated circuit (PIC). This platform enables the realization of non-Abelian physics, in which the outcome of ...
The Questa One Agentic Toolkit works seamlessly with the Fuse (TM) EDA AI system, Siemens' agentic and generative framework for electronic design automation, providing customers who want a fully ...
Circuits Integrated Hellas (CIH), a company specialising in satellite communication technology, has introduced a new family of compact Ka-band power amplifier modules that combine amplification and ...
Fraunhofer IIS brings decades of expertise in system and algorithm design, e.g. for high-performance computing, low-power wireless communication, and advanced sensor technology applications. By ...
Salience Labs has entered into a manufacturing partnership with Tower Semiconductor to produce optical circuit switches designed for next‑generation artificial intelligence data centres.