Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee estimates, to provide glass substrates for between 2 million and 3 million ...

Abstract: In this study, two problems of flip chip on glass-core package substrate will be investigated. The first problem deals with the flip chip on glass-core package substrate with microbumps and ...

Abstract: Strip-lines consisting of layers of inhomogeneous substrates are widely used in high-speed transmission and high-frequency circuits such as coupled-lines and hybrid couplers. In such ...

How fully has AI taken over packaging, power and manufacturing priorities? With more than 92,000 visitors and 1,850 ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...

LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and ...