How fully has AI taken over packaging, power and manufacturing priorities? With more than 92,000 visitors and 1,850 ...

The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).

Samsung Electro-Mechanics and LG Innotek on Wednesday showcased their latest package substrates for the artificial intelligence, server and automotive sectors at a components industry exhibition. The ...

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing ready-made solutions from ...

TL;DR: Intel has restructured its glass substrate workforce, shifting from in-house development to off-the-shelf solutions, signaling a major strategic change under CEO Lip-Bu Tan. This move follows ...

Intel is reportedly abandoning its solo approach to developing glass substrates, a critical next-generation chip packaging technology. The rumored move, shared by semiconductor expert Jukan Choi, is ...

AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; ...

Intel (INTC) announced that it is is taking actions to drive better, more efficient execution across the business. The plan includes streamlining the organization, eliminating management layers and ...