A new publication from Opto-Electronic Advances; DOI 10.29026/oea.2024.240060, discusses multi-prior intelligent microscopy assisted high-throughput, pixel super-resolution quantitative phase imaging.

Not all defects are visible with the same microscope. Explore how resolution, contrast, and signal interpretation shape semiconductor failure investigations.

Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.