SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...

At the Applied Power Electronics Conference & Exposition (APEC 2025), celebrating its 40th year, over 300 exhibitors showcased their latest component advances for system power designers across a wide ...

Power devices continue to evolve rapidly as SiC and GaN technologies become more efficient, integrated, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes enable ...

Power electronics and semiconductor devices lie at the heart of modern energy conversion and control systems. Recent advances have focused on utilising wide‐bandgap materials such as silicon carbide ...

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to ...

University of Delaware mechanical engineer Bingqing Wei and an international team of colleagues have discovered a promising new material they say could pave the way for ultra-low-power electronic ...

Researchers have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal ...

A new study has revealed how tiny imperfections and vibrations inside a promising quantum material could be used to control ...

Mobile devices play an essential role in an increasingly connected and technological world. Mobile devices, as well as battery-powered gadgets, require multiple power rails and multiple power domains.