Abstract: Current research on the transmission characteristics of through silicon via-redistribution layer (TSV-RDL) interconnects is basically limited to the single-pair interconnect (a device with ...

Abstract: As the High performance Computing (HPC) market experiences explosive growth, interest for the RDL (Re-distribution Layer) interposer package is increasing due to advantages in cost and ...

Ready-to-use code and tutorial notebooks to boost your way into few-shot image classification. This repository is made for you if: you're new to few-shot learning and want to learn; or you're looking ...