Abstract: 2.5D body size is expanding due to SoC/HBM system integration to maximize artificial intelligence (AI) performance. Accordingly, thermal and mechanical stress caused by large body size is ...

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Kristine Belson and Damien de Froberville make quietly radical creative choices, gambling — and winning — on 'Demon Hunters' and the 'Spider-Verse' franchise. Now they are back with 'GOAT,' their ...