FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Glass interposers and glass core substrates are being pursued intensively by leading device makers, materials suppliers, and equipment vendors for advanced packaging applications, as discussed in ...

DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...

(MENAFN- EIN Presswire) EINPresswire/ -- A growing emphasis on advanced semiconductor packaging solutions is shaping the organic substrate packaging material market. As technology evolves rapidly, ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

The outlook of mid- to long-term demand for substrates supporting the packaging of HPC chips remains bright despite recent speculation that the market for related substrates is oversupplied. Save my ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...