Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.

I’m reading about an unusual robotic construction system and comparing it to 3D printing. Construction 3D printing today, also known as “3DCP” involves extrusion of concrete with a specialized ...

April 17, 2026 • Do you avoid small talk in the office, or with your neighbor in the elevator? If so, you might want to give it a chance. According to a study just published in the Journal of ...

Founded in 1958 as the Xuzhou branch of Nanjing Medical College, Xuzhou Medical University became independent the following year and took on its current name in 2016. Based in one of Eastern China’s ...