Bourns, introduced four new multilayer chip inductor series: CE0603G, CE0603M, CE1005Q, and CE1608Q. The inductors feature a monolithic structure created through advanced multilayer technology. They ...
Baya Systems Partners with Aion Silicon on SoC and Chiplet Design Solution Amid Rising Chiplet Adoption in AI and HPC M31 Technology Validates MIPI M-PHY v5.0 IP on 4nm Process, Advances 3nm Work for ...