Grinn has announced a collaboration with Renesas Electronics to introduce the Grinn ReneSOM-V2H, a production-ready system-on-module (SOM) designed to accelerate the development of AI- and ...

A new approach is a Capability Hardware Enhanced RISC Instructions (CHERI)-enabled processor that offers a structural, deterministic fix. CHERI is available as an extension to RISC-V and other ...

Producing semiconductors for automotive applications is the focal point of this partnership. Automakers globally struggled to secure semiconductor supply chain in 2025, specifically for memory and ...

Cadence Design Systems Inc. has launched an agentic AI solution for automating front-end silicon design and verification. Claiming the first agentic workflow for automating chip design and ...

Siemens has introduced the Questa One Agentic Toolkit, an extension of its Questa One smart verification platform to accelerate register-transfer level (RTL) design and verification using agentic AI.

Here’s a roundup of this week’s must-read articles. We’ll look into the latest developments on UFS 5.0 Flash memory devices, a new presence detection solution, an agentic AI toolkit for chip ...

AMD has announced the second-generation family of its mid-range Kintex UltraScale+ field-programmable gate array (FPGA) at the Integrated Systems Europe (ISE) 2026 tech event. The new FPGA series ...

Infineon Technologies AG has announced a strategic acquisition of the non-optical analog/mixed-signal sensor portfolio from ams Osram Group. This €570 million deal, structured on a debt-free and ...

Over the past several years, event-based vision sensors (EVS) have attracted continuous attention across the semiconductor and AI industries. Unlike conventional CMOS image sensors (CIS), these ...