Grinn has announced a collaboration with Renesas Electronics to introduce the Grinn ReneSOM-V2H, a production-ready system-on-module (SOM) designed to accelerate the development of AI- and ...

Producing semiconductors for automotive applications is the focal point of this partnership. Automakers globally struggled to secure semiconductor supply chain in 2025, specifically for memory and ...

Here’s a roundup of this week’s must-read articles. We’ll look into the latest developments on UFS 5.0 Flash memory devices, a new presence detection solution, an agentic AI toolkit for chip ...

Microchip Technology has announced a partnership with Hyundai Motor Group (HMG) to investigate the implementation of advanced in-vehicle network solutions utilizing 10BASE-T1S Single-Pair Ethernet ...

Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Cisco Unveils Silicon One G300 AI Networking Chip The ...

“Achieving the required power integrity for extreme current densities and ultra-fast transient response is no longer realistic with board-level mounted components; embedding capacitors into the ...

Cadence Design Systems Inc. has launched an agentic AI solution for automating front-end silicon design and verification. Claiming the first agentic workflow for automating chip design and ...

Infineon Technologies AG has announced a strategic acquisition of the non-optical analog/mixed-signal sensor portfolio from ams Osram Group. This €570 million deal, structured on a debt-free and ...

Over the past several years, event-based vision sensors (EVS) have attracted continuous attention across the semiconductor and AI industries. Unlike conventional CMOS image sensors (CIS), these ...