Forefront RF, a Cambridge-based fabless semiconductor scale-up, has launched, what it believes to be the industry’s first commercially available tunable duplexer module, the FFM51010, implemented ...

Teledyne Microwave UK, part of Teledyne Technologies Incorporated, has announced the release of its new Wideband Limiter, a passive 0.1–20 GHz RF protection module designed to enhance the ...

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver ...

HARMAN, the automotive technology leader and subsidiary of Samsung Electronics Co., Ltd., announces a new collaboration with Viasat Inc., a global leader in satellite communications, to introduce ...

Saelig Company, Inc. has introduced the STD-504 transceiver, designed for reliable communication in the crowded the ISM 2.4 GHz band. Allowing for worldwide operation, the STF-504 is compliant with EN ...

MaxLinear, Inc., a leading provider of wireless infrastructure solutions, today announced that Samji Electronics has selected MaxLinear’s Sierra single‑chip radio system‑on‑chip (SoC) to power its ...

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced its participation at MWC Barcelona, March 2-5, 2026.

Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another important milestone for the 6G ecosystem research and development, demonstrating carrier aggregation across the FR1 and FR3 ...

TMYTEK's AiP modules feature embedded FPGA-based beam steering and mature APIs, streamlining gNB integration and accelerating the path from prototype to product. TMYTEK's AiP modules complies with ...

Eviden, the Atos Group product brand leading in cybersecurity products, mission-critical systems and vision AI today announces the successful completion of a Satellite Communications Spectrum ...

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G, CE0603M, ...

Visit us at booth 47 to learn more about our technologies and current developments – and to talk directly to our team of experts. The FlexLink R25 represents an unique, innovative and clever L-Band ...