FREMONT, Calif., Nov. 15, 2022 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

Amtech Systems is a hold, reflecting its expansion into high-margin advanced packaging and a debt-free balance sheet through 2026. Click for more on ASYS stock.

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

By Max A. Cherney SAN JOSE, California, March 2 (Reuters) - ASML Holding has ambitious plans to expand its line of chipmaking ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

This article is part of the Technology Insight series, made possible with funding from Intel. We tend to focus on the latest and greatest technology nodes because they’re used to manufacture the ...

In the highly competitive realm of advanced chip packaging, Taiwan Semiconductor Manufacturing Company (TSMC) has emerged as the undeniable front-runner, according to recent data released by ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up TSMC is urgently seeking equipment suppliers ...

CEO Bill Miller highlighted 2024 as a successful year with milestones such as shipping an LSA system for 2-nanometer gate all-around logic chips and an agreement to ship an LSA evaluation to a second ...

One-on-one with Amkor’s R&D chief about why and where 2.5D and fan-outs are gaining traction, and what’s coming next. Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT ...

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...