Abstract: This paper presents the fabrication of a through-glass-via (TGV) substrate with an integrated high-g MEMS shock threshold sensor on it, which will minimize the die size of the whole sensor, ...

Abstract: In this paper, the development of a tri-axial high-g shock sensor based on ST ThELMA (Thick Epitaxial Layer for Micro-gyroscopes and Accelerometers) MEMS (Micro Electro-Mechanical Sensors) ...