Abstract: A novel wafer warpage FEA model is developed to consider the further shrinkage of the fully cured Epoxy Molding Compound (EMC) induced by the subsequent thermal treatments following the ...

ABSTRACT: The aim of this work is to study the behavior of a double-lap hybrid metallic/composite bolted joint under quasi-static tension loading at room temperature (RT) and cryogenic temperature (CT ...

Abstract: There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular MAP Package which ...

During Formnext 2025, Xenia Materials highlighted a collaboration with Italian composite engineering specialist Bercella S.p.A., which produced an aerospace lamination mold using XECARB® 40-C20-3DP, a ...