IEEE

Wire Sweep Optimization with Mold Process Simulation (Virtual DoE)

Abstract: Wire sweep is a major concern to molders as the resin flow around the wires could induce potentially high wire deformations, breakage or shorting risks. Several Mold DoE builds are conducted ...
IEEE

Minimizing Warpage of PDMS Mold by Use of a Silicon Backplate in Micro-Molding Process

Abstract: This paper reports a novel silicon-backed PDMS mold (Si-PDMS mold) designed to mitigate the warpage and deformation commonly observed in conventional PDMS molds during thermal processing. A ...
Business Standard

SHARES CLAIM DOST Simplifies IEPF Claim Refund and Share Recovery Process for Investors

New Delhi [India], February 9: SHARES CLAIM DOST, a specialised financial facilitation service, is helping investors across India recover, dematerialise and reclaim long-forgotten investments, with a ...
ThePrint

SHARES CLAIM DOST Simplifies IEPF Claim Refund and Share Recovery Process for Investors

New Delhi [India], February 9: SHARES CLAIM DOST, a specialised financial facilitation service, is helping investors across India recover, dematerialise and reclaim long-forgotten investments, with a ...
uniindia

SHARES CLAIM DOST Simplifies IEPF Claim Refund and Share Recovery Process for Investors

New Delhi [India], February 07: SHARES CLAIM DOST, a specialised financial facilitation service, is helping investors across India recover, dematerialise and reclaim long-forgotten investments, with a ...