Shambhavi Das, an Anveshana 2025 student researcher from Prayoga Institute of Education Research, has won the Best STEM Presentation Award at the International ...

随着半导体行业的迅猛发展，集成电路的设计和制造技术经历了从简单的平面二维布局到复杂的三维堆叠结构的重大转变。这种转变极大地增强了芯片的性能，并提高了其功能集成度。三维集成电路的实现关键在于硅通孔技术（TSV），该技术允许不同层级的芯片 ...

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