Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This strategic pivot ...

TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, on Thursday said it expects its leading-edge advanced packaging business to double in size to ...

TAIPEI, Feb 5 (Reuters) - ASE Technology Holding (3711.TW), opens new tab, the world's largest chip packaging and testing provider, said on Thursday that it expects its advanced packaging business to ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...

Abstract: As the semiconductor industry adopts new and more complex advanced packaging schemes, the wafer edge becomes increasingly important in terms of maximizing yield. This paper will provide an ...

Amidst the growing concern over the lack of advanced packaging facilities, especially in the US, SK hynix is stepping up to fill the gap. Reports suggest that the company plans to open a new 2.5D ...

ASE Technology Holding Co. is experiencing renewed growth, driven by surging demand for advanced semiconductor packaging and TSMC outsourcing CoWoS orders. ASX stock has returned 52.4% over the past ...

Intel has been trailing in the chip market, but when it comes to advanced packaging solutions, the company offers competitive alternatives worth considering. With the rise of high-performance ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Balazs™ provides analytical services to high-tech ...

Maskless lithography enables pattern formation directly on a surface—such as a printed circuit board or an advanced packaging substrate—without the need to produce photomasks. Maskless lithography ...