How fully has AI taken over packaging, power and manufacturing priorities? With more than 92,000 visitors and 1,850 ...

Samsung Electro-Mechanics and LG Innotek on Wednesday showcased their latest package substrates for the artificial intelligence, server and automotive sectors at a components industry exhibition. The ...

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing ready-made solutions from ...

TL;DR: Intel has restructured its glass substrate workforce, shifting from in-house development to off-the-shelf solutions, signaling a major strategic change under CEO Lip-Bu Tan. This move follows ...

Intel is reportedly abandoning its solo approach to developing glass substrates, a critical next-generation chip packaging technology. The rumored move, shared by semiconductor expert Jukan Choi, is ...

AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; ...

Intel (INTC) announced that it is is taking actions to drive better, more efficient execution across the business. The plan includes streamlining the organization, eliminating management layers and ...