Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in the world’s newest ...

Abstract: In this study, two problems of flip chip on glass-core package substrate will be investigated. The first problem deals with the flip chip on glass-core package substrate with microbumps and ...

Abstract: Strip-lines consisting of layers of inhomogeneous substrates are widely used in high-speed transmission and high-frequency circuits such as coupled-lines and hybrid couplers. In such ...