Abstract: One of the largest advantages of wafer level packaging technology and the fanout process is the promise of a dramatic reduction in process costs. Given the semiconductor packaging process, ...

Abstract: Semiconductor laser diodes (LDs) typically use lattice-matched epitaxial layers as waveguide cladding materials. We describe a new LD architecture in which the upper cladding layer is ...

Minutes before midnight on Feb. 11, the Federal Aviation Administration shut down the airspace over El Paso, Texas, for 10 days − longer than the airspace closure after 9/11 − prompting confusion and ...