Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...
As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...
The size and performance advantages of FinFETs are leading to a general industry adoption of these 3D transistors at the more advanced technology nodes. These complex transistors, however, exacerbate ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
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