A group of industry-leading optical connectivity solutions companies announce the formation of the Open CPX MSA (Open Co-packaging Multi-Source Agreement) to develop the specifications for optical ...

Molex莫仕推出 Impress 共封装铜缆解决方案，扩展近 ASIC 连接创新以满足下一代数据传输率需求 Impress 充分运用 NearStack OTS 提供的见解与工程专业知识，迄今已交付超过一百万台设备 紧凑小巧的外形和增强的耐用性可简化维护和升级，使高密度系统可适应 ...

玻璃通孔（Through-Glass Via，缩写为 TGV）是一种用于半导体封装和微电子设备等领域的微型化封装技术。TGV 工艺可实现在玻璃基板上制造精密的穿透孔（即通孔），用于后续加工填充导电材料（如金属）等工序。TGV 在玻璃中具有许多微型通孔，通常直径在10μm至 ...

The U.S. connector market was valued at USD 25.40 billion in 2025 and is projected to reach USD 43.15 billion by 2035, growing at a CAGR of 6.85% from 2026–2035. Growth is driven by rising adoption of ...