Abstract: The effects of slow wave and dielectric quasi-TEM modes due to MIS (Metal-Insulator-Semiconductor) structure TSV (Through-Silicon-Via) are analyzed by using the proposed MIS TSV model and ...

Abstract: This letter presents the design and fabrication of a through-silicon-via (TSV) structure using ultra-low-resistivity-silicon (ULRS) as the central conductor and air-gap as the insulation ...