Abstract: We developed an innovative chip-on-wafer-on-wafer (CoWoW) process, involving a three-layer vertically stacked structure comprising face-to-back (F2B) chip-on-wafer (CoW) and face-to-face ...

This project implements a cross-platform tool for focus stacking images. The application takes a set of images captured at different focus distances and combines them so that the complete subject is ...

Abstract: Vertical stacking semiconductor devices can effectively integrate more functionality in the same footprint. Memory devices are often stacked in 8 and 16 die, and prototypes for up to 64 die ...

In macro photography, one of the biggest challenges in learning how to control focus at extreme magnifications. With depth of field measured in millimeters, even the most mesmerising subjects can ...