Abstract: Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a ...

A research team affiliated with UNIST has engineered a microbial strain capable of rapidly growing in high concentrations of ...

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Nvidia’s $4B photonics push highlights InP capacity bottlenecks. Click for an updated look at Aeluma, Inc. and other companies besides ALMU that may benefit.

Abstract: We design a substrate-free, inhomogeneous grating resonantly excited by magnetic dipoles. The proposed baseless metagrating is compared with the base grating metasurface and the uniform ...