As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler ...

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

(MENAFN- EIN Presswire) EINPresswire/ -- A growing emphasis on advanced semiconductor packaging solutions is shaping the organic substrate packaging material market. As technology evolves rapidly, ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...

Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for ...

Market Scale and Growth Trajectory According to data published by industry analysts, the global PET film market was valued at approximately USD 18–20 billion in recent years and is projected to grow ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

Low-cost high-performance flexible substrate materials are now available. Solderable up to 300°C, they come with 1 oz of copper (and other custom thicknesses) on ...