Global Market for Thermal Management Technologies Projected to Hit $30 Billion by 2030

Exploring Advanced Materials, Design Breakthroughs, and Expanding Applications Across Automotive, Electronics, Data Centers, Healthcare, and Energy Sectors”Boston, March 12, 2026 (GLOBE NEWSWIRE) -- ...
IEEE

Comparison of Effective Thermal Conductivity in Radial Direction of No-Insulation, Metal ...

Abstract: The effective thermal conductivity of a high temperature superconductor (HTS) coil is an important parameter controlling the temperature of the coil in normal and off-normal operation. It is ...

An AI design strategy unlocks full-color tunability in solar windows

SHANNON, CLARE, IRELAND, February 27, 2026 /EINPresswire.com/ -- Announcing a new publication from Opto-Electronic ...
IEEE

Comparison of Electrical, Thermal, and Mechanical Performances of a fcBGA with that of a ...

Abstract: This paper studied a package originally designed with a flip chip ball grid array package (fcBGA), and now is converted to a single-chiplet fan-out package (SiPlet™). The simulation or ...